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Home > Gist > Show Report 2006 |
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SMT/PCB & NEPCON KOREA 2006 |
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Exhibition : Feb. 15 ~ 17, 2006
- Business Day : Feb. 15 ~ 16
- Public Day : Feb. 17
Conference : Feb. 15 ~ 17, 2006 |
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Atlantic & Convention Hall, COEX, Seoul, Korea |
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K. Fairs Ltd.
The Electronic Times
Reed Exhibitions |
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- Ministry of Commerce, Industry and Energy
- Small & Medium Business Administration
- Korea Electronics Technology Institute
- Small and Medium Industry Promotion Corporation
- The institute of Electronics Engineers of Korea
- Korea Federation of Small and Medium Business
- Electronic Industries Association of Korea |
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SMT related Equipment & Materials
PCB Manufacturing Equipment & Materials
Electronic Parts Manufacturing Equipment & Materials
Automatic Machines and Materials for Production of IT Terminals
Electronic Components & Test/Inspection Equipment
EMI Control Equipment & Materials
Microelectronics and Packaging
Other Equipment & Materials
- BGA/SMD rework system
- Fume Extraction System
- Metal Soldering & Desoldering product
- Forming Machine, etc.
FPD Manufacturing Pavilion
- Panel Assembly Systems
- Plate Processing Equipment
- TFT, LCD Test, Measurement & Repairment Systems
- Production System / Components / Materials for Organic ELs
- PDP Production Systems / Components / Materials
- Cleaning Equipment / ESD safe Product
- Parts & Materials
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17,658 sqm (890 Booths, 430Companies from 23 countries) |
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Date |
Visitor |
Ratio |
Feb. 15 |
5,433 |
28.5% |
Feb. 16 |
6,939 |
36.4% |
Feb. 17 |
6,669 |
35.1% |
Total |
19,041 |
100% |
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Classification |
Number |
Ratio(%) |
Management |
2,396 |
14.8 % |
Purchase |
4,153 |
25.7 % |
Sales & Marketing |
1,862 |
11.5 % |
Technical |
3,192 |
19.7 % |
R&D |
3,369 |
20.8 % |
Quality Control |
918 |
5.7 % |
Others |
286 |
1.8 % |
Total |
16,176 |
100.0 % |
Visit Motivation
Media |
Attendee |
Ratio(%) |
PR Kit. Invitation flyer |
18,013 |
45.5 % |
TV/Radio Broadcasting |
7,619 |
19.3 % |
Fax/E-mail |
1,002 |
2.5 % |
News Paper |
4,243 |
10.7 % |
Magazine |
3,105 |
7.8 % |
Home Page |
2,733 |
6.9 % |
Placard & Banner |
878 |
2.2 % |
Others |
1,967 |
5.0 % |
Total |
39,560 |
100.0 % |
Classification of Company
Classification of Company |
Number |
Ratio(%) |
Manufacturer of SMT |
4,779 |
28.4 % |
Manufacturer of PCB |
4,311 |
25.6 % |
Manufacturer of Display |
1,356 |
8.1 % |
Electronic Parts & Components Manufacturer |
2,375 |
14.1 % |
Info/Communication Components Manufacturer |
1,529 |
9.1% |
Trade |
245 |
1.5 % |
Research |
1,147 |
6.8 % |
Manufacturer |
718 |
4.3 % |
Others |
356 |
2.1 % |
Total |
16,816 |
100.0 % |
Number of Interests
Field of Interest |
Attendee |
Ratio(%) |
Equipment & Materials for SMT |
7,052 |
23.5 % |
Equipment & Materials for PCB |
6,276 |
20.9 % |
Equipment & Materials for Display |
5,497 |
18.3 % |
Equipment & Materials for Electronic parts & Components |
5,071 |
16.9 % |
Equipment & Materials for Information & Components Industry |
4,506 |
15.0 % |
Others |
1,658 |
5.5 % |
Total |
30,060 |
100 % |
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Feb. 15 ~ Feb. 17, 2006 |
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Rm.402, 403 Conference Center , 4F, COEX |
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Date |
Guests |
Apr. 15 |
685 |
Apr. 16 |
568 |
Apr. 17 |
342 |
Total |
1,595 |
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Feb. 15(Wed.), 2006 Rm.403 Conference Center, 4F, COEX
09:00~15:00 |
Registration |
09:20~09:30 |
Opening Talks |
Hak-Kyung Sung
(Managing Director of
Samsung Electronics Co., Ltd) |
Session Chair: Yong-Bin Sun(Professor of Kyonggi Univ.) |
09:30~10:10 |
Embedded Passive Technology in Plastic Base PCB |
Young-Joo Ko
(General Manager of Daeduck Electronics Co., Ltd) |
10:10~10:50 |
Passive Components Embedding Technology |
Han-Seo Cho
(Principal Engineer of Samsung Electro-Mechanics Co., Ltd) |
10:50~11:00 |
Coffee Break |
Session Chair Chang-Youl Moon(Doctor of SAIT) |
11:00~11:40 |
Embedded PCB Trimmer Development |
Jae-Kyung Jang
(Manager of EO Tchnics
Co., Ltd) |
11:40~12:20 |
Polymer-Ceramic Powder Composite Embedded Capacitor Materials for Organic Substrates Applications |
Kyung-Wook Paik
(Professor of KAIST) |
12:20~13:30 |
Lunch |
Session Chair Young-Jun Moon(Senior Engineer of Samsung Electronics Co., Ltd) |
13:30~14:10 |
PCB Embedded Devices Technology |
Sung-Gue Lee
(Director of LG Electronics
Co., Ltd) |
14:10~14:50 |
A Review of Wafer-Level Embedded Passive Technology |
Suk-Jin Ham
(Doctor of SAIT) |
14:50~15:00 |
Coffee Break |
Session Chair Young-Ho Kim(Professor of Hanyang Univ.) |
15:00~15:40 |
3D SMT for System Miniaturization |
Se-Young Jang
(Senior Engineer of Samsung Electronics Co., Ltd) |
15:40~16:20 |
3D Package |
Kenny Lee
(Managing Director of
Stats ChipPac Korea) |
16:20~17:00 |
Reliability Study of Package on Package |
Young-Hyo Eun
(Senior Engineer of
Amkor Tchnology Korea Inc.) |
Feb. 16(Thu.), 2006 Rm.403 Conference Center, 4F, COEX
Time |
Subject |
Speaker |
13:00~13:50 |
Real Time SMT Line Control System |
Hyung-Duck, Kim, President of Hankuk Valence Co., Ltd. |
14:00~14:50 |
LEAD-FREE SOLDERING
TECHNOLOGY & HIGHT
FREQUENCY SOLDERING IRON TIP TECHNOLOGY |
Mr. D.S Kim, President of GOOD FEEL CO., LTD. |
15:00~16:50 |
ESD Control of SMT/PCB electronic industry ? IC destructrion, adhesion of alien substance |
Yoo Yong Hoon, President of Coreinsight Inc. |
Feb. 17(Fri.), 2006 Rm.403 Conference Center, 4F, COEX
Time |
Subject |
Speaker |
13:00~13:50 |
Hand soldering and rework with lead/free solders |
Mr. son tae sung,
OK KOREA CO., LTD. |
14:00~14:50 |
2nd level underfill ? Flip-chip and
CSP Underfill application
(interpretation service) |
Karl I. Loh, Zymet, USA |
15:00~15:50 |
3D X-ray with Semiconductor and SMT field |
Dr. Sangchul Lee |
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